The Design of New Ultrasonic Transducers for Wire bonding Devices

Author

Wu, Yimin ; Chen, Jian ; Zhao, Xingyu ; Wang, Fujun

Author_Institution

Tianjin Univ., Tianjin

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

3

Abstract

Ultrasonic transducer is an important part of bonding-head in wire bonding device. Bonding quality is effected by ultrasonic transducer properties. According to a dimension plane-wave theory, an initial design of ultrasonic transducer is presented. Ultrasonic transducer modal frequency is calculated by FEM. Prototype is fabricated and tested using impedance analysis instrument. Experimental results indicate that ultrasonic transducer has 128 kHz longitudinal vibration frequency. Ultrasonic transducer vibration properties can satisfied the demand of wire bonding device.

Keywords

finite element analysis; integrated circuit bonding; lead bonding; ultrasonic bonding; ultrasonic transducers; FEM; bonding quality; dimension plane-wave theory; frequency 128 kHz; impedance analysis instrument; modal frequency; ultrasonic transducers; wire bonding devices; Bonding; Equations; Frequency; Mechanical engineering; Prototypes; Slabs; Testing; Ultrasonic transducers; Vibrations; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441411

Filename

4441411