DocumentCode :
2903320
Title :
Summary Report: Component Design Discussion Group
Author :
Tyree, Vance ; Kuo, Clinton
Author_Institution :
Information Sciences/USC
fYear :
1992
fDate :
25-28 Oct. 1992
Firstpage :
231
Lastpage :
232
Keywords :
Degradation; Design automation; Dielectric breakdown; Electromigration; Fabrication; Fault tolerance; Hot carriers; Integrated circuit testing; Manufacturing processes; Process design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
Conference_Location :
Lake Tahoe, CA, USA
Type :
conf
DOI :
10.1109/IWLR.1992.658010
Filename :
658010
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2903320
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