Thermal Management of High-power White LED Package

Author

Cheng, Qian

Author_Institution

Harbin Inst. of Technol., Harbin

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

5

Abstract

With the increasing luminous efficacy of light emitting diode (LED) and the successful fabrication of power high brightness LED chip (HB-LED), solid state lighting using white HB-LED becomes feasible. A novel package and thermal analysis based on ANSYS software for high-power white LED were presented in this thesis. Package structures were optimized based on the result of thermal analysis. Considering cost and dimensional limitation, the thermal structural optimization of LED was achieved.

Keywords

integrated circuit packaging; integrated optoelectronics; light emitting diodes; power integrated circuits; thermal analysis; thermal management (packaging); ANSYS software; high-power white LED package; light emitting diode; luminous efficacy; package structures; power high brightness LED chip; solid state lighting; thermal analysis; thermal management; thermal structural optimization; Brightness; Heat sinks; Light emitting diodes; Materials science and technology; Packaging; Semiconductor materials; Temperature distribution; Thermal conductivity; Thermal management; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441417

Filename

4441417