Title :
Electrical Characterization of the High Speed I/O Data Bus Using Cross Correlation Method
Author :
Huang, Jimmy Huat Since ; Ahmad, Zuri Shaameri ; Yew, Teong Guan
Author_Institution :
Univ. Technol. Malaysia, Skudai
Abstract :
High speed data transportation between the CPU and peripherals on the PC motherboard is needed to support heavy data traffic such as multimedia, games and broadband networks. At multi Gbits/sec high speed, impedance mismatch between the CPU and peripherals becomes critical and limits the possible maximum throughput. The I/O transportation bus can be modeled as a linear time invariant system. The output signal at the receiver is the convolution function of the transfer function and transmitter signal. Due to the complexity of the motherboard ingredient, it is desired to model the I/O bus in black box behavior model. Instead of using traditional passive measurement method such as Time Domain Reflectometry (TDR) and Scattering parameter measurement. Cross correlation method is used to find out the impulse response transfer function when the I/O Bus is active. By using MATLAB and SPICE tools, the method is simulated to understand its environment.
Keywords :
S-parameters; reflectometry; system buses; I/O transportation bus; black box behavior model; cross correlation method; electrical characterization; heavy data traffic; high speed I/O data bus; high speed data transportation; impedance mismatch; linear time invariant system; maximum throughput; scattering parameter measurement; time domain reflectometry; Broadband communication; Correlation; Impedance; Mathematical model; Telecommunication traffic; Throughput; Time measurement; Traffic control; Transfer functions; Transportation;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441420