Title :
Creep Characterization of Lead Free 80Au-20Sn Solder
Author :
Su, Fei ; Wei, Jun ; Tew, Jin Wah
Author_Institution :
Beijing Univ. of Aeronaut. & Astronaut., Beijing
Abstract :
Summary form only given. Lead free 80Au-20Sn solder was widely used in photonics packages and sometimes in electronic packages. As in other cases, mechanical properties of the solder materials is very critical for its reliability evaluation (e.g. fatigue life prediction). However, mechanical properties of this material is not well studied, part of the reason may be the cost. In this paper, steady-state creep behavior of lead free 80Au-20Sn solder was investigated at three different temperatures and a range of stress levels. Hyperbolic-sine model was employed to characterize the creep properties of the lead free solder, constants in the model (including the activation energy) were determined through data fitting and were compared with that of other lead free solders. Activation energy of the solder material was also experimentally investigated and compared with the fitted data.
Keywords :
creep testing; electronics packaging; gold alloys; reliability; soldering; solders; tin alloys; Au-Sn; activation energy; creep characterization; electronic packages; hyperbolic-sine model; lead free solder; mechanical properties; photonics packages; reliability evaluation; solder materials; steady-state creep behavior; Costs; Creep; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Materials reliability; Mechanical factors; Photonics; Steady-state;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441422
