Title :
Effect of Thermal-Shearing Induced Microstructural Coarsening on SnAgCu Microelectronic Solder
Author :
Qi, Lihua ; Huang, Jihua ; Zhao, Xingke ; Zhang, Hua
Author_Institution :
Univ. of Sci. & Technol., Beijing
Abstract :
The creep response of solder joints in a microelectronic package, which are subjected to aggressive thermal-shearing cycling during service, often limits the reliability of the entire package. Furthermore, during cycle, the microstructures of the new lead-free solders (Sn-Ag-Cu) can undergo significant in strain-enhanced coarsening, resulting in in-service evolution of the creep behavior. In this paper, the coarsening kinetics of Ag3Sn particles in Sn-Ag-Cu solder are studied, and the results are correlated with impression creep data from individual microelectronic solder balls subjected to thermal aging treatments. The formation mechanism of Ag3Sn particles under the thermal-shearing cycling condition was investigated.
Keywords :
ageing; copper alloys; creep; creep testing; integrated circuit packaging; silver alloys; solders; tin alloys; Ag3Sn particle formation mechanism; Ag3Sn particles coarsening kinetics; SnAgCu; aggressive thermal-shearing cycling test; creep response; impression creep data; lead-free solders; microelectronic solder balls; strain-enhanced coarsening; thermal aging treatments; thermal-shearing induced microstructural coarsening; Aging; Copper; Creep; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Microelectronics; Microstructure; Soldering; Temperature; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441428
