DocumentCode
2903884
Title
High mobility strained p-channel germanium quantum well field effect transistor for low power (Vcc = 0.5 V) III–V CMOS applications
Author
Pillarisetty, Ravi
Author_Institution
Components Res., Technol. & Manuf. Group, Intel Corp., Hillsboro, OR, USA
fYear
2011
fDate
20-22 June 2011
Firstpage
231
Lastpage
232
Abstract
In this talk, we review recent research results (Pillarisetty et al., 2010) investigating the germanium quantum well field effect transistor (QWFET) for use as the p-channel device option for future low power (Vcc = 0.5V) III-V CMOS architecture. We demonstrate a high mobility Ge p-channel QWFET, with scaled TOXE = 14.5Å and mobility of 770 cm2/V*s at ns =5×1012 cm-2. For TOXE <; 40 Å, this represents the highest hole mobility reported for any Ge device and is 4x higher than state-of-the-art strained silicon (Packan et al., 2008). Furthermore, at Vcc = 0.5V, the Ge QWFET exhibits 2x higher drive current at fixed Ioff than the best III-V (Radosavljevic et al., 2008) and germanium devices (Mitard et al., 2008) reported to date. These results suggest the Ge QWFET is a viable p-channel option for non-silicon CMOS.
Keywords
III-V semiconductors; elemental semiconductors; field effect transistors; germanium; low-power electronics; quantum well devices; Ge; III-V CMOS applications; III-V CMOS architecture; QWFET; drive current; germanium devices; high mobility strained p-channel germanium quantum well field effect transistor; nonsilicon CMOS; p-channel device option; voltage 0.5 V;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference (DRC), 2011 69th Annual
Conference_Location
Santa Barbara, CA
ISSN
1548-3770
Print_ISBN
978-1-61284-243-1
Electronic_ISBN
1548-3770
Type
conf
DOI
10.1109/DRC.2011.5994510
Filename
5994510
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