Effect of Dopant on Microstructure and Mechanical Properties of Pb-Free Solder Joints

Author

Li, G.Y.

Author_Institution

South China Univ. of Technol., Guangzhou

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

5

Abstract

The effect of Sb addition on IMC growth in Sn-3.5 Ag-0.7 Cu solder joints has been studied in this work. IMC morphologies of Sn-3.8 Ag-0.7 Cu solder joints have been changed as a result of the Sb addition. The IMC layer becomes thinner with the increase in Sb proportion. It is observed that the fine particles precipitating increase in IMC layer with the increase in Sb proportion during reflow. Sb addition can increase the activation energy of Sn-3.8 Ag-0.7 Cu solder alloy system, and reduce the atomic diffusion rate, so as to inhibit the excessive growth of the IMC. It is found that the solder alloy with about 0.8 wt% Sb has the highest activation energy and lowest interdiffusion coefficient for the formation of the IMCs. The tensile strength can be slightly improved by Sb addition and is significantly affected by the IMC formation in solder joints.

Keywords

antimony; copper alloys; precipitation; reflow soldering; silver alloys; solders; tensile strength; tin alloys; IMC growth; SnAgCu; activation energy; atomic diffusion rate; dopant effect; interdiffusion coefficient; intermetallic compound layer; mechanical properties; solder joints microstructure; tensile strength; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Mechanical factors; Microstructure; Morphology; Ovens; Scanning electron microscopy; Soldering; Tin alloys;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441449

Filename

4441449