Synthesis and Characterization of Novel Multiaromatic Epoxy Resin for Advanced Microelectronic Packaging Applications

Author

Tao, Zhiqiang ; Ding, Jiapei ; Yang, Haixia ; Fan, Lin ; Yang, Shiyong

Author_Institution

Chinese Acad. of Sci., Beijing

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

3

Abstract

The novel multiaromatic epoxy resin and hardener was synthesized and characterized. The mechanical, thermal, electrical as well as flame retardant properties of cured epoxy resins were systematically investigated. Experiment results indicated that the cured novel multiaromatic resins exhibited very good mechanical properties, good electrical properties, high glass transition temperature, good dielectric properties, low moisture absorption and very good flame retardancy.

Keywords

dielectric properties; integrated circuit packaging; polymers; advanced microelectronic packaging applications; cured epoxy resins; dielectric properties; electrical properties; flame retardancy; flame retardant properties; glass transition temperature; mechanical properties; moisture absorption; multiaromatic epoxy resin; thermal properties; Absorption; Dielectrics; Epoxy resins; Flame retardants; Glass; Mechanical factors; Microelectronics; Moisture; Packaging; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441455

Filename

4441455