Preparation and Properties of Sn-9Zn-3Bi-Cr Based Lead-free Solder

Author

Li, Qi ; Hu, Anmin ; Li, Ming ; Mao, Dali

Author_Institution

Shanghai Jiao Tong Univ., Shanghai

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

5

Abstract

The influence of different Cr content on oxidation resistance, thermal properties, wetting properties, growth of intermetallic compound of Sn-9Zn-3Bi based solder are described herein, and compare with eutectic Sn-9Zn solder. Cr element segregates in the near-surface layer, and improves the oxidation resistance which contributes to better wettability at the meantime. Sn-9Zn-3Bi-0.3Cr solder shows the best oxidation resistance and wetting properties, followed by Sn-9Zn-3Bi-0.1Cr solder. Because of its small amount, Cr addition causes little change in solidus and liquidus temperature of Sn-9Zn-3Bi alloy. Micrographs of Sn-9Zn-3Bi-xCr/Cu interfaces indicate that the addition of Cr can obviously restrain growth of IMCs, and Sn-9Zn-3Bi-0.3Cr alloy has the thinnest thickness of IMCs.

Keywords

bismuth alloys; chromium alloys; eutectic alloys; oxidation; scanning electron microscopy; solders; thermal properties; tin alloys; wetting; zinc alloys; Sn-Zn-Bi-Cr; eutectic solder; intermetallic compound growth; lead-free solder; oxidation resistance; thermal properties; wettability; wetting properties; Bismuth; Chromium alloys; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Oxidation; Plasma temperature; Surface resistance; Thermal resistance; Zinc;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441466

Filename

4441466