DocumentCode
2904314
Title
Oxidation Behavior and Intermetallic Compounds Growth of Sn-Ag-Bi-Cr Lead-free Solder
Author
Wang, Huan ; Hu, Anmin ; Li, Chengkang Chang Ming ; Mao, Dali
Author_Institution
Shanghai Jiao Tong Univ., Shanghai
fYear
2007
fDate
14-17 Aug. 2007
Firstpage
1
Lastpage
4
Abstract
Concentrations of 0.1. 0.3. and 0.5 wt.% of Cr were added to Sn-3Ag-3Bi alloy to produce Sn-Ag-Bi-Cr alloys. The microstmcture is refined with Cr additions, while significantly improves the oxidation resistance. There is no change in the wettability and liquidus temperature after Cr additions. In addition, the effect of Cr addition on the intermetallic compounds was discussed.
Keywords
bismuth alloys; chromium alloys; oxidation; silver alloys; solders; tin alloys; Sn-Ag-Bi-Cr; intermetallic compounds; lead-free solders; oxidation resistance; Bismuth; Chromium alloys; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Materials science and technology; Oxidation; Soldering; Surface resistance; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1392-8
Electronic_ISBN
978-1-4244-1392-8
Type
conf
DOI
10.1109/ICEPT.2007.4441468
Filename
4441468
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