DocumentCode
2904380
Title
Time-resolving imaging and its analysis of drilling process of thin silicon substrates with femtosecond laser ablation
Author
Yokotani, A. ; Mukumoto, T. ; Kurosawa, K. ; Ninomiya, T. ; Sawada, H.
Author_Institution
Dept. of Electr. & Electron. Eng., Miyazaki Univ.
fYear
2005
fDate
17-17 June 2005
Firstpage
668
Lastpage
668
Abstract
In this paper, we have observed and analyzed the drilling process with femtosecond laser on the silicon surface in order to investigate a degree of thermal effect during the dicing process of the thin silicon substrate
Keywords
high-speed optical techniques; laser ablation; laser beam machining; optical images; silicon; Si; degree of thermal effect; dicing process; drilling process; femtosecond laser ablation; silicon surface; thin silicon substrates; time-resolving imaging; Delay effects; Drilling; Image analysis; Laser ablation; Laser transitions; National electric code; Optical pulses; Silicon; Space vector pulse width modulation; Ultrafast electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Europe, 2005. CLEO/Europe. 2005 Conference on
Conference_Location
Munich
Print_ISBN
0-7803-8974-3
Type
conf
DOI
10.1109/CLEOE.2005.1568444
Filename
1568444
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