• DocumentCode
    2904396
  • Title

    Green Policy in an International Power Management Manufacturing Services Provider in China

  • Author

    Fang, Wangsheng ; Yang, Hongbo ; Zhou, Ming ; Tsui, Anthony C.

  • Author_Institution
    GEM Electron. Co. Ltd., Shanghai
  • fYear
    2007
  • fDate
    14-17 Aug. 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Nowadays, power management semiconductor suppliers have taken big steps to provide environmentally sound and green product solutions to meet the ever increasing demand of high performance electronics in the global consumer, industrial, computer, communication and automotive markets. The challenges are two fold. Very strict reliability performance and the green requirements have to be met at the same time. These requirements mainly bring three challenges to current electronic device manufacturers: Lead-free plating process, green compound package and Pb-free die attach materials. GEM. as an international power management manufacturing services provider, has already taken action to meet the global new requirement. In tins paper, the research path and process improvement of green package manufacturing in GEM is presented, and the packaging trend of future high power and high thermal capability power management device is also discussed.
  • Keywords
    environmental factors; semiconductor device manufacture; semiconductor device packaging; China; green package manufacturing; green policy; international power management; manufacturing services provider; power management semiconductor suppliers; process improvement; research path; Communication industry; Consumer electronics; Electronic packaging thermal management; Energy management; Environmental management; Green products; Industrial electronics; Manufacturing processes; Semiconductor device manufacture; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1392-8
  • Electronic_ISBN
    978-1-4244-1392-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2007.4441473
  • Filename
    4441473