Title :
A Novel Electro-Optical Magnetic Microsensor with Reducing Interference Packaging
Author :
Chang, Hsing-Cheng ; Hung, San-Shan ; Tsou, Chingfu ; Liu, Wen-Fung ; Lai, Chi-Chih ; Jian, Ching-Shang
Author_Institution :
Feng Chia Univ., Taichung
Abstract :
A novel electro-optical magnetic microsensor with reducing interference packaging mechanism for sensing magnetic field strength is demonstrated. Both capacitive and optical fiber sensing microstructures surrounded magnetic shields are fabricated in a chip using low temperature silicon-based MEMS compatible technology. Varied NiFe permalloy flaps embedded on polyimide membranes were used as flexible sensing mechanisms to actuate side-polished fiber and capacitor plate. The fiber Bragg gratings are used as optical sensors with high sensitivity. Results of simulations and experiments show that the structures can reduce interference and then increasing sensitivity and performance effectively. A sensitivity of 0.35nm/T is achieved by evaluating the peak shift of Bragg wavelength excited by Nd-Fe-B magnets with residual magnetic strength up to 1.12 T.
Keywords :
Bragg gratings; Permalloy; capacitive sensors; electromagnetic interference; fibre optic sensors; magnetic field measurement; magnetic sensors; microsensors; Nd-Fe-B; NiFe; capacitive sensor; capacitor plate; electro-optical magnetic microsensor; fiber Bragg gratings; flexible sensing mechanism; interference packaging mechanism; low temperature silicon-based MEMS compatible technology; magnetic field strength sensing; magnetic flux density 1.12 T; magnetic shields; optical fiber sensing microstructures; permalloy flaps; polyimide membranes; side-polished fiber; Interference; Magnetic shielding; Micromagnetics; Micromechanical devices; Microstructure; Optical fiber sensors; Optical fibers; Packaging; Polyimides; Temperature sensors; Capacitive sensor; Fiber Bragg grating; Magnetic microsensor; Microsensor packaging; Optical sensor;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441484