Embedded cooling scheme to increase the electronics packing density for MPM

The conventional method of cooling the electronics by a cold plate, forces the electronic designer to spread all the heat dissipating components in single plane at the bottom. The proposed scheme, allows to populate the electronics is on both sides of the plate thus increasing the packing density and decreasing the volume. The various layout options, with the improved cooling were analyzed, using FloTHERM for fluid flow and heat transfer to arrive at a module with improved electronic performance, greater reliability, smaller volume (75% of the existing unit) and lesser weight (nearly 50% of the existing unit). The chassis was fabricated with the most optimum layout and the test results show a highly favorable temperature distribution.