Title :
Design of miniaturized RF SAW duplexer package
Author :
Hao Dong ; Wu, Thomas X.
Author_Institution :
Central Florida Univ., Orlando, FL, USA
Abstract :
This paper provides a comprehensive methodology for accurate analysis and design of miniaturized RF SAW duplexer package. Full-wave analysis is applied to get the package model. Die and bonding wire modeling is also discussed. After that, improvement of the isolation is investigated. Simulation and measurement results are compared and excellent agreement is found. The technique developed in this paper reduces the design cycle time significantly and can be applied to various RF SAW device packages.
Keywords :
integrated circuit bonding; integrated circuit design; integrated circuit packaging; isolation technology; radiofrequency integrated circuits; surface acoustic wave devices; RF SAW device packages; RF SAW duplexer package; bonding wire modeling; die modeling; full-wave analysis; isolation improvement; package model; Bonding; Electronics packaging; Filters; Radio frequency; Radio transmitters; Receivers; Receiving antennas; Surface acoustic wave devices; Surface acoustic waves; Wire;
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
DOI :
10.1109/ULTSYM.2003.1293106
