Title :
A New In-process Measurement Method for Wafer Surface Roughness
Author :
Guo, Ruipeng ; Tao, Zhengsu
Author_Institution :
Shanghai Jiao Tong Univ., Shanghai
Abstract :
A new in-process optical measurement method is presented for measuring surface roughness of wafer in machining process. The surface quality of wafer, which is the basic material of IC chips, plays an important role in the machining process of IC chips. The arithmetic average height parameter (Ra) is chose to evaluate the surface quality of wafer and an in-process optical measurement is established. A clean fluid beam has been proposed for use to remove the coolants to create an optical measurement region to realize the measurement of the surface roughness. The feasibility of extracting the surface roughness by means of image processing of the spatial distribution of the scattered light intensity is analyzed.
Keywords :
computer vision; light scattering; machining; measurement by laser beam; optical images; optical information processing; surface roughness; surface topography measurement; IC chip material; arithmetic average height parameter; clean fluid beam; coolant removal; image processing; in-process optical measurement method; laser light illumination; machine vision; machining process; scattered light intensity distribution; wafer surface quality; wafer surface roughness measurement; Arithmetic; Coolants; Image processing; Machining; Optical materials; Optical scattering; Rough surfaces; Semiconductor device measurement; Surface cleaning; Surface roughness;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441507
