A New Approach for the Evaluation of Interfacial Reliability in Micro-scale

Author

Zhu, Qingsheng ; Zhang, Zhefeng ; Shang, Jianku ; Wang, Zhongguang

Author_Institution

Chinese Acad. of Sci., Shenyang

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

3

Abstract

Lead-free solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the lead-free solder/copper single crystal joint. The types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the damage modes of the IMC interface, the interfacial reliability can be well evaluated in micro-scale.

Keywords

copper; fatigue cracks; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; slip; solders; Cu; cyclic loading; fatigue cracking modes; interfacial fatigue damage mechanisms; interfacial reliability; intermetallic compound; lead-free solder-copper single crystal joints; microelectronic packaging; persistent slip bands; Aging; Copper; Crystal microstructure; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Materials science and technology; Soldering; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441515

Filename

4441515