Title :
A New Approach for the Evaluation of Interfacial Reliability in Micro-scale
Author :
Zhu, Qingsheng ; Zhang, Zhefeng ; Shang, Jianku ; Wang, Zhongguang
Author_Institution :
Chinese Acad. of Sci., Shenyang
Abstract :
Lead-free solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the lead-free solder/copper single crystal joint. The types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the damage modes of the IMC interface, the interfacial reliability can be well evaluated in micro-scale.
Keywords :
copper; fatigue cracks; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; slip; solders; Cu; cyclic loading; fatigue cracking modes; interfacial fatigue damage mechanisms; interfacial reliability; intermetallic compound; lead-free solder-copper single crystal joints; microelectronic packaging; persistent slip bands; Aging; Copper; Crystal microstructure; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Materials science and technology; Soldering; Testing;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441515
