Title :
Study on Failure Mechanism of BGA Solder Joints Crack during Wave Soldering
Author :
Wang, Wen-li ; Liang, Yong-sheng
Author_Institution :
Shenzhen Inst. of Inf. Technol., Shenzhen
Abstract :
This paper introduces the solder joints of BGA on PCB top side appearing crack phenomenon after the bottom side passed wave soldering, the reason for solder joints crack is that partial solder joints are dewetting on the component side IMC pad. Through many kinds of failure analysis method, the failure analysis conclusion is that BGA solder joints crack is due to the solder joints melting during wave soldering. The direct reason is that component side pad´s coating is gold on nickel, but PCB side pad´s coating is HASL finish, copper from PCB pad migrates across the BGA ball while the solder joint melt, thus Ni-Sn-Cu IMC is formed on the component side pad.
Keywords :
ball grid arrays; copper alloys; cracks; failure analysis; nickel alloys; printed circuit manufacture; solders; tin alloys; wave soldering; BGA solder joints crack; HASL finish; IMC pad; NiSnCu; PCB pad; ball grid arrays; component side pad; crack phenomenon; failure analysis method; failure mechanism; pad coating; printed circuit boards; wave soldering; Assembly; Coatings; Curing; Electrical products; Failure analysis; Information technology; Printing; Process design; Reflow soldering; Testing;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441517
