DocumentCode
2905256
Title
Single event upset and multiple cell upset modeling in commercial bulk 65 nm CMOS SRAMs and flip-flops
Author
Uznanski, Slawosz ; Gasiot, Gilles ; Roche, Philippe ; Tavernier, Clement ; Autran, Jean-Luc
Author_Institution
Central CAD & Design Solutions, STMicroelectronics, Crolles, France
fYear
2009
fDate
14-18 Sept. 2009
Firstpage
194
Lastpage
200
Abstract
A new proprietary Monte-Carlo simulation code dedicated to the heavy-ion cross-section prediction has been developed. The code is based on diffusion-collection equations taking into account recombination processes, considering an improved drain strike model, and new upset analysis algorithms for different circuit architectures. Simulated cross-sections are compared to heavy ion experimental characterizations for commercial bulk 65 nm single- and dual-port SRAMs. Simulation capabilities of much more complex circuits are demonstrated considering a 65 nm radiation-hardened-by-design Flip-Flop (FF).
Keywords
CMOS memory circuits; Monte Carlo methods; SRAM chips; diffusion; flip-flops; integrated circuit testing; CMOS SRAM; Monte-Carlo simulation code; circuit architecture; diffusion-collection equation; drain strike model; dual-port SRAM; heavy-ion cross-section prediction; multiple cell upset modeling; radiation-hardened-by-design flip-flop; recombination process; single event upset; size 65 nm; upset analysis algorithm; Computer architecture; Integrated circuit modeling; Junctions; Mathematical model; Microprocessors; Random access memory; SPICE;
fLanguage
English
Publisher
ieee
Conference_Titel
Radiation and Its Effects on Components and Systems (RADECS), 2009 European Conference on
Conference_Location
Bruges
ISSN
0379-6566
Print_ISBN
978-1-4577-0492-5
Electronic_ISBN
0379-6566
Type
conf
DOI
10.1109/RADECS.2009.5994579
Filename
5994579
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