• DocumentCode
    2905256
  • Title

    Single event upset and multiple cell upset modeling in commercial bulk 65 nm CMOS SRAMs and flip-flops

  • Author

    Uznanski, Slawosz ; Gasiot, Gilles ; Roche, Philippe ; Tavernier, Clement ; Autran, Jean-Luc

  • Author_Institution
    Central CAD & Design Solutions, STMicroelectronics, Crolles, France
  • fYear
    2009
  • fDate
    14-18 Sept. 2009
  • Firstpage
    194
  • Lastpage
    200
  • Abstract
    A new proprietary Monte-Carlo simulation code dedicated to the heavy-ion cross-section prediction has been developed. The code is based on diffusion-collection equations taking into account recombination processes, considering an improved drain strike model, and new upset analysis algorithms for different circuit architectures. Simulated cross-sections are compared to heavy ion experimental characterizations for commercial bulk 65 nm single- and dual-port SRAMs. Simulation capabilities of much more complex circuits are demonstrated considering a 65 nm radiation-hardened-by-design Flip-Flop (FF).
  • Keywords
    CMOS memory circuits; Monte Carlo methods; SRAM chips; diffusion; flip-flops; integrated circuit testing; CMOS SRAM; Monte-Carlo simulation code; circuit architecture; diffusion-collection equation; drain strike model; dual-port SRAM; heavy-ion cross-section prediction; multiple cell upset modeling; radiation-hardened-by-design flip-flop; recombination process; single event upset; size 65 nm; upset analysis algorithm; Computer architecture; Integrated circuit modeling; Junctions; Mathematical model; Microprocessors; Random access memory; SPICE;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radiation and Its Effects on Components and Systems (RADECS), 2009 European Conference on
  • Conference_Location
    Bruges
  • ISSN
    0379-6566
  • Print_ISBN
    978-1-4577-0492-5
  • Electronic_ISBN
    0379-6566
  • Type

    conf

  • DOI
    10.1109/RADECS.2009.5994579
  • Filename
    5994579