DocumentCode :
2905331
Title :
Efficient single event upset simulations of a tolerant PD SOI CMOS D Flip-Flop
Author :
Alvarado, J. ; Kilchytska, V. ; Berger, G. ; Flandre, D.
Author_Institution :
Microelectron. Lab., Univ. Catholique de Louvain, Louvain-la-Neuve, Belgium
fYear :
2009
fDate :
14-18 Sept. 2009
Firstpage :
225
Lastpage :
229
Abstract :
A simple way for modeling the single event upset (SEU) in Partially Depleted (PD) SOI CMOS circuits by Spice simulations is presented. A Verilog-A module connected to the body contact of PD SOI MOSFET is implemented to describe the transient current generated by an ion-track crossing the transistor. Verilog-A module is given by a physical based compact model and hence accounts for all variations in MOSFET´s physical parameters (i.e. mobility, lifetime, etc.) caused by irradiation, temperature, bias conditions, etc. Good agreement with mixed-mode numerical simulations is observed at different conditions. Both kinds of simulations show that PD SOI CMOS D Flip-Flop is tolerant to high LET energies, whereas bias supply reduction as well as an increase in the clock frequency of the flip-flop can degrade this tolerance.
Keywords :
CMOS logic circuits; SPICE; circuit simulation; flip-flops; hardware description languages; silicon-on-insulator; LET energy; MOSFET physical parameter; Si; Spice simulation; Verilog-A module; clock frequency; ion-track crossing; mixed mode numerical simulation; partially depleted SOI CMOS circuit; single event upset simulation; tolerant PD SOI CMOS D flip-flop; transient current generation; CMOS integrated circuits; Clocks; Flip-flops; Hardware design languages; Semiconductor device modeling; Single event upset; Transient analysis; Circuit and device simulation; heavy ion irradiation; silicon on insulator; single event upset;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radiation and Its Effects on Components and Systems (RADECS), 2009 European Conference on
Conference_Location :
Bruges
ISSN :
0379-6566
Print_ISBN :
978-1-4577-0492-5
Electronic_ISBN :
0379-6566
Type :
conf
DOI :
10.1109/RADECS.2009.5994584
Filename :
5994584
Link To Document :
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