• DocumentCode
    2905368
  • Title

    The Impact of Defect formed in Hot-cutting Process on Reliability of Ceramic Packaging And A Novel Structure Design Concept

  • Author

    Zeng, Chao ; Wang, Chunqing ; Tian, Yanhong ; Kong, Lingchao

  • Author_Institution
    Harbin Inst. of Technol., Harbin
  • fYear
    2007
  • fDate
    14-17 Aug. 2007
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper investigates the defect formed by the mechanical cutting processing of green sheet of alumina ceramic by evaluating the surface integrity in terms of surface morphology, and the flexural strength and its variance. The Weibull strength distribution method is introduced to compare the strength between defect-contained specimens and specimens without hot-cutting defect. Experimental results show that the defect causes a remarkable decline in strength and small specimens are more affected than big ones. The surface contains the hot-cutting defect is more dangerous than the natural surface. A FEM method (ANSYS) is utilized to quantitatively evaluate residual stresses of the ceramic insulator in brazing process. Based on the stress analysis, a Defect-free-stress design concept is put forward to give some guidance to structure design and material selection.
  • Keywords
    Weibull distribution; aluminium compounds; bending strength; ceramic packaging; cutting; finite element analysis; FEM method; Weibull strength distribution method; alumina ceramic; brazing process; ceramic insulator; ceramic packaging reliability; defect-free-stress design concept; flexural strength; hot-cutting defect; mechanical cutting processing; residual stress; structure design concept; surface morphology; Assembly; Ceramics; Chaos; Manufacturing processes; Material storage; Packaging machines; Residual stresses; Surface cracks; Surface morphology; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1392-8
  • Electronic_ISBN
    978-1-4244-1392-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2007.4441525
  • Filename
    4441525