DocumentCode
2905411
Title
Effect of Vacuum Package on the Stiction Force of Micro-structure
Author
Liu, Junwen ; Song, Jing ; Huang, Qingan ; Tang, Jieying
Author_Institution
Southeast Univ., Nanjing
fYear
2007
fDate
14-17 Aug. 2007
Firstpage
1
Lastpage
6
Abstract
Vacuum packaging is introduced as a main mode for the MEMS (micro-electronics-mechanical-system) devices packaging. The reliability of devices in a vacuum package has become the most important part for the successful commercialization. With the decrease in the dimension and material processing, the ubiquitous surface effect between device and substrate has become more and more effective. Surface-micromachined structures formed by the wet etching of sacrificial layers are commonly plagued by problems of sticking to the substrate. The failure of devices according to the stiction has become a main factor of the MEMS reliability. In this paper, we present an experimental way to analyze the two important force of the surface effect: the capillary force and the van der Waals force. We use the cantilever beam as a classic MEMS device, and the structure of beam is specially designed for the experiment. We believe that it can greatly reduce the capillary force in the vacuum environment, so we separate the two forces through two different environmental experiments. This paper simulates different packaging environment to divide capillary force from stiction force, and analyzes the composition of the stiction force. The experimental results and theoretical summary could provide a useful reference for the design and predict the stiction failure of micro-structure.
Keywords
beams (structures); cantilevers; electronics packaging; failure analysis; micromachining; micromechanical devices; reliability; stiction; vacuum techniques; MEMS device reliability; capillary force; electrostatically driven cantilever beam; material processing; microelectronics-mechanical-system; microstructural stiction failure prediction; stiction force; surface-micromachined structures; ubiquitous surface effect; vacuum packaging; van der Waals force; wet etching; Commercialization; Electrostatics; Microelectromechanical devices; Micromechanical devices; Microstructure; Packaging; Rough surfaces; Structural beams; Surface roughness; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1392-8
Electronic_ISBN
978-1-4244-1392-8
Type
conf
DOI
10.1109/ICEPT.2007.4441527
Filename
4441527
Link To Document