Title :
Reliability Analysis of Lead-free Flip Chip Solder Joint
Author :
Wang, Dong ; Ma, Xiaosong ; Guo, Dan
Author_Institution :
Guilin Univ. of Electron. Technol., Guilin
Abstract :
The purpose of this paper is to study effect of thermal cycle condition on the reliability of lead-free flip chip solder joint. Flip chip assembly was subjected to thermal cycle (MIT-STD-883) condition. Two dimensional finite element analysis (FEA) has been carried out using ANSYS commercial software. There are two types of lead-free solder (Sn96.5-Ag3.5 and Sn95.5-Ag3.8-Cu0.7). They used flip chip solder joints have been evaluated. For each lead-free flip chip solder joint, thermal stress and strain have been studied. The plastic strain is mainly effect on thermal fatigue of solder joint, so two types of lead-free solder joint compare with Sn63-Pb37 solder joint in equivalent plastic strain, and thermal fatigue life of these three types of solder joint has been analyzed and assessed.
Keywords :
copper alloys; finite element analysis; reliability; silver alloys; soldering; thermal stresses; tin alloys; ANSYS; SnAgCu; flip chip assembly; lead-free flip chip solder joint; plastic strain; reliability analysis; thermal cycle condition; thermal fatigue; thermal strain; thermal stress; two dimensional finite element analysis; Assembly; Capacitive sensors; Environmentally friendly manufacturing techniques; Fatigue; Flip chip; Flip chip solder joints; Lead; Plastics; Soldering; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441538
