Reliability Analysis of Lead-free Flip Chip Solder Joint

Author

Wang, Dong ; Ma, Xiaosong ; Guo, Dan

Author_Institution

Guilin Univ. of Electron. Technol., Guilin

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

5

Abstract

The purpose of this paper is to study effect of thermal cycle condition on the reliability of lead-free flip chip solder joint. Flip chip assembly was subjected to thermal cycle (MIT-STD-883) condition. Two dimensional finite element analysis (FEA) has been carried out using ANSYS commercial software. There are two types of lead-free solder (Sn96.5-Ag3.5 and Sn95.5-Ag3.8-Cu0.7). They used flip chip solder joints have been evaluated. For each lead-free flip chip solder joint, thermal stress and strain have been studied. The plastic strain is mainly effect on thermal fatigue of solder joint, so two types of lead-free solder joint compare with Sn63-Pb37 solder joint in equivalent plastic strain, and thermal fatigue life of these three types of solder joint has been analyzed and assessed.

Keywords

copper alloys; finite element analysis; reliability; silver alloys; soldering; thermal stresses; tin alloys; ANSYS; SnAgCu; flip chip assembly; lead-free flip chip solder joint; plastic strain; reliability analysis; thermal cycle condition; thermal fatigue; thermal strain; thermal stress; two dimensional finite element analysis; Assembly; Capacitive sensors; Environmentally friendly manufacturing techniques; Fatigue; Flip chip; Flip chip solder joints; Lead; Plastics; Soldering; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441538

Filename

4441538