Title :
Image Inspecting System of Positioning Accuracy of the Die Bonder
Author :
Huang, Xiangxiu ; Li, Ketian ; Liu, Ji´an ; Liu, Jian-qi ; Weng, Ji-zhao
Author_Institution :
Guangdong Univ. of Technol., Guangzhou
Abstract :
This article realizes online inspection of the positioning accuracy of the high speed die bonder by using Lab VIEW, IMAQ Vision and Motion, combined with the PCI-1409 images acquiring and PCI-7330 motion control hardware devices and image processing algorithm such as image calibration, image enhance, and pattern matching.
Keywords :
calibration; computer vision; electron device manufacture; electronic engineering computing; image enhancement; image matching; inspection; microassembling; motion control; production engineering computing; IMAQ Vision and Motion; Lab VIEW; PCI-1409 images; PCI-7330 motion control hardware devices; die bonder; image calibration; image enhancement; image inspecting system; image processing algorithm; online inspection; pattern matching; positioning accuracy; Bonding; Calibration; Charge coupled devices; Control systems; Image edge detection; Image processing; Inspection; Motion control; Pattern matching; Pixel;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441540
