Title :
Fabrication of multi-functional integrated liquid sensors using MEMS and film-bonding technology
Author :
Kaneshiro, C. ; Koh, K. ; Hohkawa, K. ; Yamamura, A. ; Matsumoto, K.
Author_Institution :
Dept. of Electr. & Electr. Eng., Kanagawa Inst. of Technol., Atsugi, Japan
Abstract :
In this paper, we present the results of a basic study on fabrication technology of integrated sensors circuit, in which the various sensors based on the mass loading effect, a conductive change, and photo-luminescence methods are integrated on piezoelectric substrate. We propose a design of micro-pump with a simple structure for low cost. Also, the experimental result shows that its controllability of liquid flux is very high sensitive. Moreover, we adopt Au-IDT electrodes with immobilized oxidases for sensing glucose concentration.
Keywords :
chemical sensors; integrated circuit bonding; integrated circuit design; micromechanical devices; micropumps; sugar; Au-IDT electrodes; MEMS; conductive change; fabrication technology; film-bonding technology; glucose concentration sensing; immobilized oxidases; integrated sensors circuit; liquid flux controllability; mass loading effect; micropump; multifunctional integrated liquid sensors; photoluminescence methods; piezoelectric substrate; Bonding; Chemical technology; Electrodes; Fabrication; Magnetic materials; Micromechanical devices; Micropumps; Piezoelectric materials; Semiconductor materials; Substrates;
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
DOI :
10.1109/ULTSYM.2003.1293148
