Properties and Reliability of Sn-Pb and Lead-free Mixed Soldering

Author

Huan Wang ; Anmin Hu ; Lihong Wang ; Ping Zhu ; Chengkang Chang ; Ming Li

Author_Institution

Shanghai Jiao Tong Univ., Shanghai

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

4

Abstract

During the transition from Sn-Pb solder to lead-free solder, it is inevitable to encounter the reliability difficulties when lead-free and Sn-Pb materials were used within the same mounting process. To solve the problem in the mixed soldering, two methods were adopted that is improving the soldering temperature and electroplating Sn-Pb on the surface of the devices then soldering in a lower temperature. Mechanical strength of the solder joint, fracture morphology and the intermetallic compound (IMC) at the interface between solder and board materials were investigated. The experimental results showed the inclination of pores evolving when improving the solder temperature reduces the reliability. However, symmetrical solder joint with high reliability was obtained in the second method.

Keywords

electroplating; lead alloys; reliability; soldering; solders; tin alloys; Sn-Pb materials; SnPb; board materials; electroplating; fracture morphology; intermetallic compound; lead-free materials; lead-free mixed soldering; lead-free solder; mechanical strength; mounting process; soldering temperature; symmetrical solder joint; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Leg; Materials reliability; Materials science and technology; Printed circuits; Soldering; Surface morphology; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441544

Filename

4441544