Title :
Properties and Reliability of Sn-Pb and Lead-free Mixed Soldering
Author :
Huan Wang ; Anmin Hu ; Lihong Wang ; Ping Zhu ; Chengkang Chang ; Ming Li
Author_Institution :
Shanghai Jiao Tong Univ., Shanghai
Abstract :
During the transition from Sn-Pb solder to lead-free solder, it is inevitable to encounter the reliability difficulties when lead-free and Sn-Pb materials were used within the same mounting process. To solve the problem in the mixed soldering, two methods were adopted that is improving the soldering temperature and electroplating Sn-Pb on the surface of the devices then soldering in a lower temperature. Mechanical strength of the solder joint, fracture morphology and the intermetallic compound (IMC) at the interface between solder and board materials were investigated. The experimental results showed the inclination of pores evolving when improving the solder temperature reduces the reliability. However, symmetrical solder joint with high reliability was obtained in the second method.
Keywords :
electroplating; lead alloys; reliability; soldering; solders; tin alloys; Sn-Pb materials; SnPb; board materials; electroplating; fracture morphology; intermetallic compound; lead-free materials; lead-free mixed soldering; lead-free solder; mechanical strength; mounting process; soldering temperature; symmetrical solder joint; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Leg; Materials reliability; Materials science and technology; Printed circuits; Soldering; Surface morphology; Temperature;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441544
