DocumentCode
2905709
Title
The Development of Semiconductor Packaging and Testing Industry of China
Author
Bi, Keyun
Author_Institution
Chinese Inst. of Electron., Beijing
fYear
2007
fDate
14-17 Aug. 2007
Firstpage
1
Lastpage
3
Abstract
The semiconductor industry of China develops rapidly. From 2001 to 2006, China IC industry keeps growing rapidly at an average yearly increase of 33.6%, much higher than the world IC industry increase. In 2006, China IC industry scales 100.63 billion RMB Yuan. China IC industry occupies a higher percentage from 1.9% of year 2001 to 6.1% of 2006. IC design, manufacturing, packaging and testing industries are developing rapidly and synchronously.
Keywords
integrated circuit design; integrated circuit manufacture; integrated circuit packaging; integrated circuit testing; China; IC design; IC industry; IC manufacturing; IC packaging; semiconductor industry; semiconductor packaging; testing industry; Electronic equipment testing; Electronics industry; Electronics packaging; Manufacturing industries; Marketing and sales; Packaging machines; Plastic packaging; Production; Semiconductor device packaging; Semiconductor device testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1392-8
Electronic_ISBN
978-1-4244-1392-8
Type
conf
DOI
10.1109/ICEPT.2007.4441546
Filename
4441546
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