• DocumentCode
    2905722
  • Title

    A model of contact mechanism for a quartz-crystal tuning-fork tactile sensor

  • Author

    Itoh, Hideaki ; Ishikawa, Kiyoshi ; Fujiwara, Yasunobu ; Mizushima, Takamitsu

  • Author_Institution
    Fac. of Eng., Shinsu Univ., Nagano, Japan
  • Volume
    2
  • fYear
    2003
  • fDate
    5-8 Oct. 2003
  • Firstpage
    1342
  • Abstract
    We investigated the contact mechanism for a quartz-crystal tuning-fork tactile sensor theoretically. On the assumption that the right half of a quartz-crystal tuning fork as an L-shaped bar, in which the bars acting as the base and the arm undergo bending vibration, we analyzed the frequency of a tuning-fork tactile sensor by considering the base of the tuning fork on the basis of Sezawa´s approximation and the torsion spring model as a joining mechanism of the base and the arm, and furthermore both lateral clamping force from acrylic resin case and Winkler´s foundation from the object in contact are applied on its base. Five kinds of metals (brass, copper, aluminum, stainless steel, and iron) were used in this contact experiment. The frequency of a quartz-crystal tuning-fork tactile sensor increased according to the ratio of Young´s modulus to density of materials and classified into two groups owing to the magnitudes of sound velocity of longitudinal wave traveling into metals when the sensor´s base got brought into contact with a surface of materials after the surface has been polished with #800 sandpaper.
  • Keywords
    crystal oscillators; piezoelectric devices; quartz; tactile sensors; L-shaped bar; Sezawa approximation; Winkler foundation; Young modulus; acrylic resin case; bending vibration; contact mechanism; lateral clamping force; longitudinal wave; material density; quartz-crystal tuning fork; sound velocity magnitude; tactile sensor; torsion spring model; tuning fork base; tuning fork frequency; Acoustic materials; Bars; Clamps; Force sensors; Frequency; Inorganic materials; Springs; Surface waves; Tactile sensors; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293151
  • Filename
    1293151