DocumentCode :
2905728
Title :
William T. Chen
fYear :
2007
fDate :
14-17 Aug. 2007
Firstpage :
1
Lastpage :
1
Keywords :
Assembly; Components, Packaging, and Manufacturing Technology Society; Components, packaging, and manufacturing technology; Education; Electronics packaging; Joining materials; Materials science and technology; Research and development; Research and development management; Semiconductor device packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
Type :
conf
DOI :
10.1109/ICEPT.2007.4441547
Filename :
4441547
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2905728
بازگشت