Title :
SiP - A Catalyst for Innovation
Author_Institution :
President of IEEE-CPMT, USA
Abstract :
This talk will review the electronic market landscape. Today consumers have become a major factor in driving innovations in the electronics industry towards expanding envelops of requirements in lower cost, smaller form factor. and increased functionality. System in package (SiP) and system on chip (SoC) are two powerful technology directions for the industry to rise to the challenges posed by the consumer-driven market place. The fundamental concept of SiP has been a catalyst to free the engineering community to drive packaging structure in the 3rd dimensions and to integrate beyond traditional digital IC technologies, to MEMS. RF & mixed signal. optoelectronics and bio chips.
Keywords :
catalysts; system-in-package; system-on-chip; SiP; catalyst; consumer-driven market place; electronics industry; system in package; system on chip; Consumer electronics; Cost function; Digital integrated circuits; Electronics industry; Electronics packaging; Integrated circuit packaging; Micromechanical devices; Power engineering and energy; System-on-a-chip; Technological innovation;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441548
