Keywords :
Aerospace materials; Ceramics industry; Electronics industry; Electronics packaging; Industrial electronics; Manufacturing industries; Metals industry; Porcelain; Semiconductor materials; Temperature;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441549
