DocumentCode
2905762
Title
Solutions to the Technological Issues of a Global Packaging Industry
Author
Ehlert, Mike
Author_Institution
Int. Microelectron. & Packaging Soc. (IMAPS), Washington
fYear
2007
fDate
14-17 Aug. 2007
Firstpage
1
Lastpage
1
Abstract
The packaging Industry has become more and more globalized. Prices have dropped precipitously and volumes have climbed enormously in a very short time. This change has been financed by acquisitions of technological knowledge from the customers who originally designed the product. The jobs came in increments of high volume low mix products. Now many of these information resources are depleted and the industry needs to continue to grow. As the high volume low mix business lias nearly saturated this growth will occur in the lower volume higher mix market. Of necessity more engineering work will be needed than ever before. This will drive the need for more engineers and more education. As the opportunity for acquisition has decreased most of this growth will be organic. IMAPS as the professional organization that addresses the individual engineer will be the key ingredient in making this happen.
Keywords
electronics industry; semiconductor technology; IMAPS; global packaging industry; technological issues; Information resources; Microelectronics; Packaging; Product design; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1392-8
Electronic_ISBN
978-1-4244-1392-8
Type
conf
DOI
10.1109/ICEPT.2007.4441550
Filename
4441550
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