Abstract :
Summary form only give, as follows. A biographical sketch of Michael Pecht is presented. He has a BS in Acoustics, an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin at Madison. He is a Professional Engineer, an IEEE Fellow and an ASME Fellow. He has received the 3M Research Award for electronics packaging, the IEEE Undergraduate Teaching Award, and the IMAPS William D. Ashman Memorial Achievement Award for his contributions in electronics reliability analysis. He has written eighteen books on electronic products development, use and supply chain management. He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum. He is chief editor for Microelectronics Reliability and an associate editor for the IEEE Transactions on Components and Packaging Technology. He is the founder of CALCE (Center for Advanced Life Cycle Engineering) and the Electronic Products and Systems Consortium at the University of Maryland. He is also a Chair Professor. He has been leading a research team in the area of prognostics for the past ten years, and has now formed a new Electronics Prognostics and Health Management Consortium at the University of Maryland. He has consulted for over 50 major international electronics companies, providing expertise in strategic planning, design, test, prognostics, IP and risk assessment of electronic products and systems.