• DocumentCode
    2905846
  • Title

    A high temperature and broadband immersion 1-3 piezo-composite transducer for accurate inspection in harsh environments

  • Author

    Xue, Qiang ; Stanton, Matthew ; Elfbaum, Gerry

  • Author_Institution
    GE Panametrics, Waltham, MA, USA
  • Volume
    2
  • fYear
    2003
  • fDate
    5-8 Oct. 2003
  • Firstpage
    1372
  • Abstract
    A high temperature immersion 1-3 piezo-composite transducer has been developed to demonstrate performance in both bandwidth and sensitivity a compared to one constructed using a solid ceramic. One notable benefit for high temperature applications using the 1-3 composite is a large reduction of principal thermal stress in the transducer due to the compliancy of the polymer phase. Preliminary results of thermal analysis for the transducer over a temperature range from 20 °C to 180 °C reveal that the 1-3 composite construction decreases the principal thermal stress in the ceramic phase by more than 70%. This reduction allows the transducer to be operated in an extended temperature range where excessive thermal stress of a solid ceramic would cause failure of the transducer. No performance degradation was observed from the transducer after several thermal cycles over a 100 °C temperature span. Waveform and spectrum of the transducer measured in a 125°C canola oil bath are presented.
  • Keywords
    composite materials; high-temperature effects; piezoelectric materials; piezoelectric transducers; thermal stresses; ultrasonic transducers; 125 C; 20 to 180 C; accurate inspection; broadband immersion; canola oil bath; ceramic phase; harsh environments; high temperature immersion; piezo-composite transducer; polymer phase; solid ceramic; thermal analysis; thermal stress; Bandwidth; Ceramics; Inspection; Polymers; Solids; Temperature distribution; Temperature sensors; Thermal degradation; Thermal stresses; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293158
  • Filename
    1293158