• DocumentCode
    2906127
  • Title

    "More than Moore" - The changing international landscape, strategy and solutions of micro/nanoelectronics

  • Author

    Zhang, G.Q.

  • Author_Institution
    Prof., NXP Semiconductors, and Delft University of Technology, The Netherlands
  • fYear
    2007
  • fDate
    14-17 Aug. 2007
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    In the past decades, the main stream of microelectronics progresses is mainly powered by Moore\´s law, with two focused development arenas, namely, IC miniaturization down to nano scale, and SoC based system integration. While microelectronics community continues to invent new solutions around the world to keep Moore\´s law alive, there is increasing momentum for the development of "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies but do not simply scale with Moore\´s law. Typical examples are RF, Power/HV, Passive, Sensor/Actuator/MEMS, Bio-chi/packages, SiP, SSL. This increasing momentum of MtM is trigged by the increasing social needs for high level heterogeneous system integration including non-digital functions, the necessity to speed up innovative product creation and to broaden the product portfolio of wafer fabs, and the limiting cost and time factors of advanced SoC development. It is believed that MtM will add value to society on top of and beyond advanced CMOS and conventional packaging, with fast increasing marketing potentials. This two hours course will cover mainly: - Technology development trends of Micro/nanoelectronics - Business development trends of Micro/nanoelectronics - Strategic research agenda of "More than Moore" - Paradigm of "More than Moore" business creation - European\´s vision, strategy and practices for micro/nanoelectronics
  • Keywords
    Actuators; Biosensors; Microelectronics; Micromechanical devices; Moore´s Law; Nanoelectronics; Packaging; Portfolios; Radio frequency; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1392-8
  • Electronic_ISBN
    978-1-4244-1392-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2007.4441574
  • Filename
    4441574