DocumentCode
2906154
Title
Electronics Packaging Technologies for Automotive Electronics
Author
Sham, Ivan M L ; Chen, Zhong
Author_Institution
Hong Kong Applied Science & Technology Research Institute (ASTRI), China
fYear
2007
fDate
14-17 Aug. 2007
Firstpage
1
Lastpage
1
Keywords
Automotive electronics; Automotive engineering; Electronic equipment testing; Electronics packaging; Intelligent vehicles; Joining materials; Materials reliability; Materials science and technology; Soldering; Standards development;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1392-8
Electronic_ISBN
978-1-4244-1392-8
Type
conf
DOI
10.1109/ICEPT.2007.4441576
Filename
4441576
Link To Document