• DocumentCode
    2906154
  • Title

    Electronics Packaging Technologies for Automotive Electronics

  • Author

    Sham, Ivan M L ; Chen, Zhong

  • Author_Institution
    Hong Kong Applied Science & Technology Research Institute (ASTRI), China
  • fYear
    2007
  • fDate
    14-17 Aug. 2007
  • Firstpage
    1
  • Lastpage
    1
  • Keywords
    Automotive electronics; Automotive engineering; Electronic equipment testing; Electronics packaging; Intelligent vehicles; Joining materials; Materials reliability; Materials science and technology; Soldering; Standards development;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1392-8
  • Electronic_ISBN
    978-1-4244-1392-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2007.4441576
  • Filename
    4441576