Title :
System-on-a-chip global interconnect optimization
Author :
Naeemi, Azad ; Venkatesan, Raguraman ; Meindl, James D.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
The width of global interconnects is optimized to have a large bisectional bandwidth along with a small latency, power dissipation, repeater area and via blockage. The optimal wire width, which maximizes the product of data flux density OD and reciprocal delay 1/τ, is independent of the interconnect length and can be used for all global interconnects. Data flux density OD (per unit width) determines the bisectional bandwidth and therefore, the total number of bits per second that global interconnect levels can potentially transfer. Using optimal wire width decreases the latency, energy dissipation, and repeater area by 42%, 30%, and 84%, respectively compared to using half the optimal wire width at the price of 14% smaller bisectional bandwidth.
Keywords :
circuit optimisation; delays; integrated circuit design; low-power electronics; repeaters; system-on-chip; bisectional bandwidth; data flux density; energy dissipation; global interconnect width; interconnect length; latency; optimal wire width; power dissipation; reciprocal delay; repeater area; system-on-a-chip global interconnect optimization; transfer rate; via blockage; Bandwidth; Capacitance; Clocks; Conductivity; Delay; Frequency; Power system interconnection; Repeaters; System-on-a-chip; Wire;
Conference_Titel :
ASIC/SOC Conference, 2002. 15th Annual IEEE International
Print_ISBN :
0-7803-7494-0
DOI :
10.1109/ASIC.2002.1158092