Reliability Analysis of Self-Repairable MEMS Accelerometer

Author

Xiong, Xingguo ; Wu, Yu-Liang ; Jone, Wen-Ben

Author_Institution

Dept. of Electr. & Comput. Eng., Bridgeport Univ., CT

fYear

2006

fDate

4-6 Oct. 2006

Firstpage

236

Lastpage

244

Abstract

MEMS (micro electromechanical system) yield and reliability have been a very critical issue. In our previous paper, the authors have proposed a self-repairable MEMS comb accelerometer device, and the yield analysis has demonstrated effective yield increase due to the BISR (built-in self-repair) design. In this paper, the authors developed a MEMS reliability model for quantitative assessment of the MEMS reliability analysis. Based on this model, analysis of the reliability of both non-BISR and BISR MEMS comb accelerometers under z-axis shocking environment. Simulation results demonstrate very effective reliability enhancement due to the BISR design. The reliability model can also be applied to other MEMS devices under various failure mechanisms in a similar way

Keywords

accelerometers; built-in self test; microsensors; reliability; BISR; built-in self-repair design; comb accelerometer device; failure mechanisms; microelectromechanical system; quantitative assessment; reliability analysis; self-repairable MEMS accelerometer; yield analysis; z-axis shocking environment; Accelerometers; Circuits; Electric shock; Failure analysis; Fingers; Microelectromechanical devices; Microelectromechanical systems; Micromechanical devices; Redundancy; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Defect and Fault Tolerance in VLSI Systems, 2006. DFT '06. 21st IEEE International Symposium on

Conference_Location

Arlington, VA

ISSN

1550-5774

Print_ISBN

0-7695-2706-X

Type

conf

DOI

10.1109/DFT.2006.54

Filename

4030934