Title :
Integration of self assembly for semiconductor microelectronics
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
Self assembling polymers can autonomously form regular patterns at sublithographic dimensions. Integration of these materials with semiconductor processing enables high-resolution patterning of microelectronic circuit elements and offers a nontraditional pathway for continued improvements in integrated circuit performance. We discuss our efforts in IBM to demonstrate key applications of self assembly for semiconductor device fabrication.
Keywords :
integrated circuit design; integrated circuit manufacture; lithography; nanoelectronics; nanopatterning; polymers; self-assembly; microelectronic circuit elements; pattern formation; self assembling polymers; self assembly; semiconductor device fabrication; semiconductor microelectronics; semiconductor processing; sublithographic dimensions; Circuits; Etching; FETs; Fabrication; Microelectronics; Polymers; Resists; Self-assembly; Semiconductor materials; Silicon;
Conference_Titel :
Custom Integrated Circuits Conference, 2005. Proceedings of the IEEE 2005
Print_ISBN :
0-7803-9023-7
DOI :
10.1109/CICC.2005.1568615
