Title :
A miniaturized heterogeneous wireless sensor node in 3DIC
Author :
Liu, Xin ; Wang, Lei ; Jayakrishnan, Mini ; Lan, Jingjing ; Li, Hongyu ; Choong, Chong Ser ; Raja, M. Kumara-samy ; Guo, Yongxin ; Goh, Wang Ling ; He, Jin ; Gao, Shan ; Je, Minkyu
Author_Institution :
Inst. of Microelectron., Singapore, Singapore
fDate :
Jan. 31 2012-Feb. 2 2012
Abstract :
In this paper, an innovative design of a miniaturized heterogeneous 3DIC-based wireless sensor node (WSN) is proposed. The design contains stacks of radio frequency (RF) die, mixed-signal die, digital die, and integrated antenna die using the through silicon via (TSV) technology. Significant enhancements to the existing 2D design and verification flow are developed to solve the critical concerns of heterogeneous 3DIC integration, including the block-level partitioning, TSV macro design, the TSV-related modeling and characterization, and physical verification. Solutions are proposed to minimize the electromagnetic interference (EMI) effects between the IC and the antenna. The size of the proposed 3DIC is only 66% as compared to a similar 2D implementation, permitting miniaturization of the complete WSN system.
Keywords :
electromagnetic interference; integrated circuit design; interference suppression; three-dimensional integrated circuits; wireless sensor networks; 2D design; EMI minimization; RF die stacks; TSV macrodesign; TSV-related characterization; TSV-related modeling; block-level partitioning; digital die, stacks; electromagnetic interference minimization; integrated antenna die stacks; miniaturized heterogeneous 3DIC-based WSN; miniaturized heterogeneous 3DIC-based wireless sensor node; mixed-signal die stacks; physical verification; radiofrequency die stacks; through silicon via technology; verification flow; Antennas; Electromagnetic interference; Layout; Radio frequency; Silicon; Through-silicon vias; Wireless sensor networks; 3DIC; electromagnetic interference; through silicon via; wireless sensor node;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location :
Osaka
Print_ISBN :
978-1-4673-2189-1
DOI :
10.1109/3DIC.2012.6262966
