• DocumentCode
    2907598
  • Title

    An IC chip of a Dickson-type DC-DC converter with bootstrapped gate transfer switches

  • Author

    Eguchi, Kiyoshi ; Ueno, Fumiaki ; Zhu, Hengliang ; Tabata, Takekazu ; Fujiyoshi, A.

  • Author_Institution
    Dept. of Inf. & Comput. Sci., Kumamoto Nat. Coll. of Technol., Japan
  • Volume
    B
  • fYear
    2004
  • fDate
    21-24 Nov. 2004
  • Firstpage
    77
  • Abstract
    A VLSI chip of a Dickson-type DC-DC converter with bootstrapped gate transfer switches is introduced in this paper. In the proposed converter, high efficiency can be achieved by adopting novel bootstrap circuits to power-switches. Via maximum circuits constructed with diodes, the voltage of forward stage is charged to a capacitor in the bootstrap circuit. By connecting the charged-capacitor between the gate terminals of power-switches and the output terminal of the maximum circuit, the bootstrap circuits reduce the on-resistance of the power-switches. The SPICE simulations for the proposed circuit show that the voltage efficiency of DC-DC conversion is more than 90% when the output load Ro=500 Ω. Furthermore, the proposed circuit is implemented into a 2.3×2.3 mm chip in the chip fabrication program of VLSI Design and Education Center (VDEC). The IC chip can be fabricated by a standard 1.2 μm CMOS process.
  • Keywords
    CMOS integrated circuits; DC-DC power convertors; SPICE; VLSI; bootstrap circuits; capacitors; switching convertors; 1.2 micron; 500 ohm; CMOS process; Dickson-type DC-DC converter; IC chip; SPICE simulation; VDEC; VLSI Design and Education Center; VLSI chip; bootstrapped gate transfer switches; capacitor; charged-capacitor; chip fabrication program; diodes; on-resistance reduction; power-switches; voltage efficiency; Circuit simulation; DC-DC power converters; Diodes; Joining processes; SPICE; Switched capacitor circuits; Switches; Switching converters; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2004. 2004 IEEE Region 10 Conference
  • Print_ISBN
    0-7803-8560-8
  • Type

    conf

  • DOI
    10.1109/TENCON.2004.1414535
  • Filename
    1414535