Title :
Fabrication and characterization of 0.2 to 6 μm GaInAs/InP electron waveguides
Author :
Maximov, I. ; Wang, Q. ; Graczyk, M. ; Omling, P. ; Samuelson, L. ; Seifert, W. ; Shorubalko, I. ; Hieke, K. ; Lourdudoss, S. ; Messmer, E.R.
Author_Institution :
Dept. of Solid State Phys., Lund Univ., Sweden
Abstract :
We demonstrate fabrication technology and characterization results of GaInAs/InP electron waveguides with lengths between 0.2 and 6 μm. The waveguides, 50 to 100 nm wide, are produced by deep wet etching of high mobility 2DEG MOVPE-grown G0.25In0.75As/InP structures. The waveguide structures are defined by electron beam lithography and a nonselective etching in either HCl:CH3COOH:H2O2 or HBr-based solutions. A 250 nm-thick ZEP520 electron beam resist is used as an etch mask after a post-development baking at 120°C to enhance its adhesion to the substrate. After etching, the structures were regrown by nominally undoped InP layer in a low-pressure MOVPE process or by Fe-doped InP in an atmospheric pressure hydride vapor phase epitaxy (HVPE). The Fermi energy is controlled by applying voltage to resist-insulated top gate or side gates. A well defined quantized conductance at 0.3 K of heterostructurally-defined electron waveguides with length of up to 3 μm is demonstrated
Keywords :
Fermi level; III-V semiconductors; MOCVD coatings; adhesion; electron beam lithography; electron waveguides; etching; gallium arsenide; gallium compounds; indium compounds; semiconductor epitaxial layers; two-dimensional electron gas; 0.2 to 6 mum; 0.3 K; 2DEG; Fermi energy; GaInAs-InP; MOVPE; adhesion; baking; deep wet etching; electron beam lithography; electron beam resist; electron waveguides; high mobility structures; hydride VPE; nonselective etching; quantized conductance; Adhesives; Electron beams; Epitaxial growth; Epitaxial layers; Indium phosphide; Lithography; Optical device fabrication; Resists; Substrates; Wet etching;
Conference_Titel :
Indium Phosphide and Related Materials, 1999. IPRM. 1999 Eleventh International Conference on
Conference_Location :
Davos
Print_ISBN :
0-7803-5562-8
DOI :
10.1109/ICIPRM.1999.773679