DocumentCode
2907918
Title
Mechanical and electrical reliability of copper interconnections for 3DIC
Author
Saito, Naoki ; Murata, Naokazu ; Tamakawa, Kinji ; Suzuki, Ken ; Miura, Hideo
Author_Institution
Fracture & Reliability Res. Inst., Tohoku Univ., Sendai, Japan
fYear
2012
fDate
Jan. 31 2012-Feb. 2 2012
Firstpage
1
Lastpage
6
Abstract
The mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their electroplating conditions and thermal history after electroplating. The change of their microstructure was the main reason for the variation. The crystallinity of the micro texture was evaluated quantitatively by applying an electron back-scattering diffraction method.
Keywords
copper; electron backscattering; electroplating; integrated circuit interconnections; integrated circuit reliability; three-dimensional integrated circuits; 3D IC; copper interconnections; electrical reliability; electron back-scattering diffraction method; electroplated copper thin films; mechanical reliability; microtexture crystallinity; thermal history; Annealing; Copper; Current density; Fatigue; Films; Grain boundaries; Surface cracks;
fLanguage
English
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location
Osaka
Print_ISBN
978-1-4673-2189-1
Type
conf
DOI
10.1109/3DIC.2012.6262998
Filename
6262998
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