DocumentCode :
2908246
Title :
Study of Insulation Monitoring Device for DC System Based on Multi-switch Combination
Author :
Jiang, Jishun ; Ji, Hua
Author_Institution :
Dept. of Electr. & Electron. Eng., Shandong Univ. of Technol., Zibo, China
Volume :
1
fYear :
2009
fDate :
12-14 Dec. 2009
Firstpage :
429
Lastpage :
433
Abstract :
This paper introduces the design principle of a new insulation monitoring device on DC system based on AT89S52. The method of measuring insulation resistance between ground and DC power supply using switch-controlled is proposed, by which the state of combination switch can be changed though programming, a variety of effective circuit structure can be produced, linear equations of voltage sampling on different circuit structure can be established, so resistance to ground of positive and negative electrode of dc bus and the value of bus voltage can be got. In this paper, designs of hardware circuit and software flow and analysis on testing results have been given. The results of preproduction in Shandong Huineng Electric Co., Ltd. show that the design technique of this new type device is novel, and has characteristics of accurate measurement, flexible method of finding grounding branches, and low cost. Therefore, it is especially suitable for dc system insulation on-line monitoring of power plant and substation.
Keywords :
CMOS integrated circuits; computerised monitoring; earthing; flowcharting; insulation testing; power plants; switched mode power supplies; AT89S52; DC power supply; DC system; bus voltage; combination switch; hardware circuit; insulation monitoring device; insulation resistance; multiswitch combination; on-line monitoring; power plant; software analysis; software flow; software testing; substation; voltage sampling; Circuit testing; Electrical resistance measurement; Insulation; Linear programming; Monitoring; Power measurement; Power supplies; Switches; Switching circuits; Voltage; DC System; grounding fault; insulation monitoring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computational Intelligence and Design, 2009. ISCID '09. Second International Symposium on
Conference_Location :
Changsha
Print_ISBN :
978-0-7695-3865-5
Type :
conf
DOI :
10.1109/ISCID.2009.115
Filename :
5368912
Link To Document :
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