• DocumentCode
    2908282
  • Title

    Finite element modeling of CMUTs using a perfectly matched layer for fast simulation

  • Author

    Bozkurt, Ayhan

  • Author_Institution
    Fac. of Eng. & Nat. Sci., Sabanci Univ., Istanbul, Turkey
  • Volume
    2
  • fYear
    2003
  • fDate
    5-8 Oct. 2003
  • Firstpage
    1979
  • Abstract
    Capacitative micromachined ultrasonic transducer (CMUT) cells generate plate waves within the substrate on which they are constructed. Analysis of CMUT cells using finite element simulation requires a solid model with an absorbing boundary for elimination of plate wave reflections from the model boundary. Although this method performs well for eliminating the reflections, it significantly increases the mesh size and hence the simulation time. An observation on the nature of the plate wave modes generated by a CMUT cell shows that more than 97% of the outgoing power is carried in the lowest order anti-symmetric (A0) Lamb wave mode. In this paper, a perfectly matched layer for the termination of the A0 mode is proposed. Boundary elements tuned for the A0 mode, reduce the reflected wave amplitude to -6 dB of the incident wave amplitude for operation frequencies up to 5 MHz. For a particular simulation model with 17,000 nodes, the proposed boundary elements reduce the mesh size by 30%.
  • Keywords
    acoustic impedance; capacitive sensors; finite element analysis; plates (structures); substrates; surface acoustic waves; ultrasonic reflection; ultrasonic transducers; -6 dB; 5 MHz; CMUT cells; absorbing boundary; antisymmetric Lamb wave mode; boundary elements; capacitative micromachined ultrasonic transducer; finite element modeling; incident wave amplitude; layer matching; mesh size; plate wave modes; plate wave reflection elimination; plate waves; reflected wave amplitude; simulation; solid model; substrate; Biomembranes; Couplings; Finite element methods; Network address translation; Perfectly matched layers; Reflection; Silicon; Solid modeling; Surface acoustic wave devices; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293304
  • Filename
    1293304