Title :
3D multiprocessor with 3D NoC architecture based on Tezzaron technology
Author :
Jabbar, M.H. ; Houzet, D. ; Hammami, O.
Author_Institution :
GIPSA-Lab., St. Martin d´´Hères, France
fDate :
Jan. 31 2012-Feb. 2 2012
Abstract :
In this paper, we describe the architecture and implementation of 3D multiprocessor with 3D NoC. The 2 tiers design is based on 16 processors communicating using a 4×2 mesh NoC and will be fabricated using Tezzaron technology with 130 nm Global Foundaries low power standard library. Due to the limitation when investigating NoC performance using simulation, the purpose of this work is to accurately measure NoC performances in real 3D chip when running mobile multimedia applications to evaluate the impact of 3D architecture compared to 2D.
Keywords :
mobile radio; multimedia communication; multiprocessor interconnection networks; network-on-chip; three-dimensional integrated circuits; 3D NoC architecture; 3D multiprocessor; Tezzaron technology; global foundary low power standard library; mobile multimedia applications; Face; Network interfaces; Performance evaluation; Program processors; Stacking; Synchronization; Through-silicon vias; 3D IC; 3D NoC; MPSoC; Tezzaron;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location :
Osaka
Print_ISBN :
978-1-4673-2189-1
DOI :
10.1109/3DIC.2012.6263027
