Title :
Sputtered AlN thin films on Si and electrodes for MEMS resonators: relationship between surface quality microstructure and film properties
Author :
Mishin, S. ; Marx, D.R. ; Sylvia, B. ; Lughi, V. ; Turner, K.L. ; Clarke, D.R.
Author_Institution :
Adv. Modular Sputtering, Inc., Goleta, CA, USA
Abstract :
Aluminum nitride thin films grown by reactive AC magnetron sputtering are characterized using several metrology techniques to examine the correlation between surface quality, microstructure and piezoelectric properties. Atomic force microscopy, X-ray diffraction and electron microscopy are employed to characterize the microstructure. A range of substrate coatings is explored to understand the impact of topography on film crystallinity and piezoelectric performance. A first order approximation model providing the piezoelectric characteristics as a function of the c-axis misorientation in the mosaic-structured wurtzite AlN films is presented. While the model predicts only a small e33, eff and kt change for a misorientation distribution of FWHM of less than 5 degrees, it services as an indication of the impact of AlN crystallinity on film piezoelectric properties.
Keywords :
X-ray diffraction; aluminium compounds; atomic force microscopy; crystal microstructure; electrodes; electron microscopy; micromechanical resonators; piezoelectric thin films; silicon; sputtering; surface topography; thin films; AlN-Si; FWHM; MEMS resonators; X-ray diffraction; atomic force microscopy; c-axis misorientation; electron microscopy; film crystallinity; film properties; first order approximation; metrology techniques; microstructure; mosaic-structured wurtzite film; piezoelectric performance; piezoelectric properties; reactive AC magnetron sputtering; substrate coatings; surface quality; thin films; Atomic force microscopy; Electrodes; Electron microscopy; Micromechanical devices; Microstructure; Piezoelectric films; Semiconductor films; Semiconductor thin films; Sputtering; Surface topography;
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
DOI :
10.1109/ULTSYM.2003.1293316