• DocumentCode
    2908906
  • Title

    Characterization of On-Wafer Vias for CMOS RFICs

  • Author

    Shi, Xiaomeng ; Yeo, Kiat Seng ; Do, Manh Anh ; Boon, Chirn Chye

  • Author_Institution
    Nanyang Technol. Univ.
  • fYear
    2007
  • fDate
    26-28 Sept. 2007
  • Firstpage
    192
  • Lastpage
    195
  • Abstract
    Characterization of a single on-wafer via using a 0.18-mum RFCMOS technology is presented in this paper. The equivalent resistance and inductance of the via are extracted from full wave simulations up to 30 GHz frequency range. The de-embedding method is also discussed.
  • Keywords
    CMOS integrated circuits; radiofrequency integrated circuits; CMOS RFIC; RFCMOS technology; deembedding method; equivalent inductance; equivalent resistance; on-wafer vias; size 0.18 mum; CMOS technology; Circuit simulation; Explosives; Inductance; Integrated circuit interconnections; Performance evaluation; Radio frequency; Radiofrequency integrated circuits; Silicon; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuits, 2007. ISIC '07. International Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-0797-2
  • Electronic_ISBN
    978-1-4244-0797-2
  • Type

    conf

  • DOI
    10.1109/ISICIR.2007.4441830
  • Filename
    4441830
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2908906