DocumentCode :
2909304
Title :
A novel flexible, reliable and easy to use technique for the fabrication of optical spot size converters for InP based PICs
Author :
Trommer, D. ; Steingrüber, R. ; Löffler, R. ; Umbach, A.
Author_Institution :
Heinrich-Hertz-Inst. fur Nachrichtentech. Berlin GmbH, Germany
fYear :
1999
fDate :
1999
Firstpage :
12
Abstract :
Spot size converters (waveguide tapers) are key elements for photonic integrated circuits (PICs) since they significantly reduce the effort and cost of the device packaging. In comparison to other technologies like micro lenses or lensed fibres the implementation of spot size converters can also reduce the optical insertion loss of the devices. The basic technological challenge is the fabrication of a vertical ramp with a maximum height of around 1 μm and a length of 500-1000 μm. Several approaches to form this ramp have been reported including shadow mask etching, shadow mask epitaxy and selective area growth. All this methods have in common that they require special processes which are rather complicated, expensive and inflexible in terms of tailoring of the ramp profile. In this paper, we present a novel method for the fabrication of spot size converters which can produce almost arbitrary taper profiles and requires only standard lithography and etching processes and can therefore easily be implemented into standard waveguide processes
Keywords :
III-V semiconductors; indium compounds; integrated optics; optical fabrication; optical waveguide components; InP; InP PIC; etching; fabrication; optical spot size converter; photolithography; photonic integrated circuit; ramp profile; waveguide taper; Costs; Etching; Integrated circuit packaging; Integrated circuit reliability; Integrated circuit technology; Lenses; Optical device fabrication; Optical fiber devices; Optical waveguides; Photonic integrated circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials, 1999. IPRM. 1999 Eleventh International Conference on
Conference_Location :
Davos
ISSN :
1092-8669
Print_ISBN :
0-7803-5562-8
Type :
conf
DOI :
10.1109/ICIPRM.1999.773768
Filename :
773768
Link To Document :
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